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July 2000

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Subject:
From:
Gary Camac <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 31 Jul 2000 16:11:41 -0500
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Steve,

J-STD-001C, 5.4.1 states " Gold shall be removed for at least 95% of the surface to be
soldered of the through-hole component lead with 2.5 um [0.0984 mil] or more of gold.

Gary Camac

"Stephen R. Gregory" wrote:

> Hi ya'll!
>
> We've got a board here that we're going to be assembling that is transferring
> from one of our other plants. They sent us a "Gold Board" so that we could
> look at it and have it in front of us to help when we write the work
> instructions.
>
> It's a all PTH board and quite large. All along one edge of the board there
> are these right-angle headers. They're from FCI/Berg and gold plated.
>
> I noticed on the "Gold Board" it looked like they had been pre-tinned. I
> hadn't ever seen that before. I went back to the stockroom and checked the
> parts we had back there, and the whole header was gold plated. I called our
> sister plant and asked if they pre-tinned the headers before installing them.
> They said they did. I asked is this something the customer requested and they
> said no, but that it was something you ALWAYS did when you are dealing with
> gold plated parts...
>
> I went to FCI's web page to see how much gold was plated on them, but I
> couldn't find the exact part there (they're still updating the web page with
> part numbers since they bought Berg). But the gold plating thickness that I
> read on the page with similar parts was either 30-µin., or 15-µin...that
> doesn't seem to me like there's enough there to worry about gold
> embrittlement, especially with a PTH joint...
>
> Do we REALLY need to pre-tin these things?
>
> Thanks!
>
> -Steve Gregory-
>
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