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July 2000

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Subject:
From:
Brian Ellis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 31 Jul 2000 16:13:36 +0300
Content-Type:
text/plain
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text/plain (74 lines)
Luis

WHOA! No irrelevant advertising here, please.

Brian

Luis Gallegos wrote:

> Good morning Stephen
> We have a glue dispenser in line with our process that applies adhesive and
> solder paste dots. When  applying solder paste dots we are getting
> consistently getting good solder joints .
> I hope this help
>
> Luis Gallegos
> Sanmina (kenosha)
> [log in to unmask] <mailto:[log in to unmask]>
> 262 947-7700
>
>         -----Original Message-----
>         From:   Stephen Thornton [SMTP:[log in to unmask]]
>         Sent:   Sunday, July 30, 2000 8:40 PM
>         To:     [log in to unmask]
>         Subject:        [TN] Wave Solering SOT23
>
>         To All Technetters,
>         This question has probably been asked many times but I'll ask the
> experts one more time
>         Can anyone tell me how to get good solder perfomance when wave
> soldering SOT23 packages
>         We have tried quite a few different things but cannot seem to get
> consistently good joints on a range of different boards and products.
>         We have layed out the lans and pads to the IPC recommendations and
> tried going larger, smaller and different orientation etc with no major
> success.
>         Has anyone out there got the key to this one?
>         Any suggestions would be appreciated.
>         Please reply to the forum so that all can share the wisdom
>         Thanks in advance
>
>         Stephen Thornton
>         Engineering Manager Tytronics
>         12 Circuit Drive Hendon SA 5014
>         Telephone: +61 (0)8 8268 5400
>         Fax: +61 (0)8 8268 2503
>
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