Patty,
If you saw Steve's photos, you already downloaded them. Look in
your "Temporary Internet Files" folder. You can simply click and drag the
jpeg files to a safer location in your computer. Technically, Steve still
owns the copyright and will need to respond that it is OK to use his
pictures. If you are an NT user, YOUR "Temporary Internet Files" folder is
buried through the "user" folder. (Use the find files in start menu.) The
internet files folder will be very full, so I usually delete everything, go
back to the web site, then re-open the folder to get the files I want.
good luck!
Ryan Grant
Advanced Technology Engineer
MCMS
(208) 898-1145
[log in to unmask]
> -----Original Message-----
> From: Goldman, Patricia J. [SMTP:[log in to unmask]]
> Sent: Wednesday, July 26, 2000 1:50 PM
> To: [log in to unmask]
> Subject: Re: [TN] "Bubbly Soldermask..."
>
> Steve,
>
> From the IPC-PE-740 Troubleshooting Guide, under Section 15.1.3 - Liquid
> Photoimageable (LPI) Solder Resist, Problem G:
> Problem - "Bubbles or craters in dried resist film (usually in thickest
> areas of the resist). Bubbles or craters following the tack dry are
> casued
> by air entrapment in the dried resist film. When they appear after
> exposure, it is usually the result of solvents left in the dried film
> which
> volatilize and move the film surface when under vacuum."
> List of Causes: "Excessive print/flood speed. Poor screen release.
> Excessive mixing of ink. Tack dry cycle too short or temperature too low.
> Insufficient air flow in oven. Tack dry temperature too hot (results in
> skinning over of mask, causing inefficient solvent release)."
> Corresponding Actions are also listed, but I don't think that matters to
> you
> at this point.
>
> I am Chairman of the Process Effects Subcommittee that produced the
> PE-740.
> We are just about to begin another revision (at the fall meeting in Miami,
> in mid-Sept. The photos are great! I would like to get them to add to
> PE-740, also any replies that don't come through Technet. How can I
> download those photos, or can you send them to me?
> Thanks, I really appreciate it!
>
> BTW, PE-740 has 21 Chapters in all, covering all aspects of
> Troubleshooting
> for Printed Board Manufacture and Assembly, including Test/Inspect.
>
> We are looking for volunteers, too, to work on the upcoming revision.
> Contact me directly at [log in to unmask] if you are interested in helping us
> out!
>
> Patty
> Patricia J. Goldman
> PPG Industries, Inc.
> 412-492-5516
> [log in to unmask]
>
>
> -----Original Message-----
> From: Stephen R. Gregory [mailto:[log in to unmask]]
> Sent: Wednesday, July 26, 2000 3:11 PM
> To: [log in to unmask]
> Subject: [TN] "Bubbly Soldermask..."
>
>
> Hi all!
>
> We just got some boards in at receiving inspection that have thousands of
> little "bubbles" in the soldermask all over the boards...they seem to
> concentrate all along the edges of the features of the board. You can see
> pictures of it at:
>
> http://www.driveway.com/share?sid=e25a88c4.8e904&name=Pictures
>
> One picture is bubblemask.jpg, the other is bubblemask2.jpg...what would
> cause that? It's a LPI...don't know the brand name. I'm thinking that
> either
> the boards weren't dry or cleaned well prior to soldermasking them. I'm
> rejecting the boards of course...
>
> My freedrive is filling up fast with all the pictures of the "pretty
> boards"
> that we get from our vendors!!!
>
> -Steve Gregory-
>
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