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July 2000

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Subject:
From:
Franklin D Asbell <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 24 Jul 2000 12:08:33 -0500
Content-Type:
text/plain
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text/plain (87 lines)
Hey Russ,

What about those of us that are still there....we're still successful in
plating up from 2 to 4...

Yes it takes effort, panel alignment, chemistry monitoring, process
control, and well designed panels but I would dare say it's no more
difficult then the majority of the work we do...again, controlling the
processes is key...

Franklin

Russ Bafford wrote:
>
> Steve,
>
> Once upon a time the bare board house I used to work for was making a 4 oz.
> finished board.  We tried plating 2 oz. up to 4 oz.  We were not able to get
> our plating uniform enough to produce a consistent 4 oz. copper surface.
>
> Take if from someone who has been there; do whatever you have to in order to
> get 3 oz. material to start with.
>
> Russ Bafford
> Sovereign Circuits
> 330-538-3900
>
> -----Original Message-----
> From: Steve Collins <[log in to unmask]>
> To: [log in to unmask] <[log in to unmask]>
> Date: Friday, July 21, 2000 4:56 PM
> Subject: [TN] 3 oz material
>
> >Are there any reliability concerns in requesting a 4 oz board to start with
> >2oz base material and plate up the extra 2 oz with plated copper over
> >starting with 3 oz base material and plating 1 oz for a 4 oz finished
> >product.
> >
> >At this point I'm not as interested in comments on price since I realize
> >the cost difference and availability issues involved here.
> >
> >Steve Collins
> >
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