did you consider the pressure cooker of THB?  T=120C H=95% Pressure=2 atm,
B=? V depend upon application...you have to correlate the pressure cooker
result with your 10 month failure rate observation and get acceleration
factor...if it is corrosion and associated with moisture, 10 month in the
field should be less than 2 weeks in pressure cooker (if it is done
right...many of the tests were not done right.  the chamber rained a
lot)...just a guess..You need to read something about HAST and some glass
passivation failure (PSG) literature from semiconductor industry (sorry,
don't have any paper on hand).  my 1.36 cents..
                                    jk
At 08:12 AM 7/24/00 -0700, you wrote:
>Moisture corrosion of a glass diode.
>
>Jason
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]]On Behalf Of Pat Kane
>Sent: Friday, July 21, 2000 12:09 PM
>To: [log in to unmask]
>Subject: Re: [TN] Failure analysis
>
>
>In a message dated 7/19/00 1:02:02 PM US Eastern Standard Time,
>[log in to unmask] writes:
>
>>
>>  If the time to failure is known (10 months) how can I develop an internal
>>  stress test to facilitate a failure in less times (like 3 weeks)
>>  I don't have a HALT chamber, but two thermal chambers
>
>Jason
>
>What is the failure you are investigating?  Dendritic growth?  Cracked
>solder
>joints? To develop an accelerated test method depends on the mechanism you
>want to accelerate.
>>
>>  The stresses that I want to use are
>>
>>  high temp (85 degrees C)
>>  low temp (-40 degrees C)
>>  salt water bath
>>  powered cycle
>
>All at once, or uniquely different tests?
>>
>>  The module is encapsulated, weight approx. 0.3 Kg,
>>
>>  PS: I don't like calculus!!!
>
>No one does.
>>
>>  Thanks for your help
>>
>>  Jason Larson
>
>Pat Kane
>Technical Sales Manager
>Contamination Studies Laboratories
>>
>
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