TECHNET Archives

July 2000

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Pat Kane <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 21 Jul 2000 15:09:01 EDT
Content-Type:
text/plain
Parts/Attachments:
text/plain (52 lines)
In a message dated 7/19/00 1:02:02 PM US Eastern Standard Time,
[log in to unmask] writes:

>
>  If the time to failure is known (10 months) how can I develop an internal
>  stress test to facilitate a failure in less times (like 3 weeks)
>  I don't have a HALT chamber, but two thermal chambers

Jason

What is the failure you are investigating?  Dendritic growth?  Cracked solder
joints? To develop an accelerated test method depends on the mechanism you
want to accelerate.
>
>  The stresses that I want to use are
>
>  high temp (85 degrees C)
>  low temp (-40 degrees C)
>  salt water bath
>  powered cycle

All at once, or uniquely different tests?
>
>  The module is encapsulated, weight approx. 0.3 Kg,
>
>  PS: I don't like calculus!!!

No one does.
>
>  Thanks for your help
>
>  Jason Larson

Pat Kane
Technical Sales Manager
Contamination Studies Laboratories
>

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
##############################################################

ATOM RSS1 RSS2