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July 2000

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Subject:
From:
John Brewer <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 20 Jul 2000 12:03:15 -0400
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Ken mentions:

> Reliability/Quality Expert,
> How can I select the thermal stress/shock profile for loaded board if I
want
> to precipitate the fab problem. Boards are functionally passed but belongs
> to suspect date code.
>
> I am looking for a profile in the following format.

Hi Ken,

Before you do any testing, a good, root cause failure analysis is
required before specifying a failure acceleration method.

Once you've conclusively identified the specifc cause of your
module failure, you can tailor a stress test to weed out that
specific problem (or fix the root cause failure reason, better yet!)

Without the root cause failure identified, you may end
up spending a lot of money, and potentially ruining a lot
of good modules  doing accelerated life/reliability testing,
with minimal return.

Rgds
John


-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-
John Brewer
Supervisor, Component Engineering
Raleigh, NC
(919)-266-8870
[log in to unmask]
-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-

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