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Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 20 Jul 2000 12:03:15 -0400 |
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Ken mentions:
> Reliability/Quality Expert,
> How can I select the thermal stress/shock profile for loaded board if I
want
> to precipitate the fab problem. Boards are functionally passed but belongs
> to suspect date code.
>
> I am looking for a profile in the following format.
Hi Ken,
Before you do any testing, a good, root cause failure analysis is
required before specifying a failure acceleration method.
Once you've conclusively identified the specifc cause of your
module failure, you can tailor a stress test to weed out that
specific problem (or fix the root cause failure reason, better yet!)
Without the root cause failure identified, you may end
up spending a lot of money, and potentially ruining a lot
of good modules doing accelerated life/reliability testing,
with minimal return.
Rgds
John
-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-
John Brewer
Supervisor, Component Engineering
Raleigh, NC
(919)-266-8870
[log in to unmask]
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