TECHNET Archives

July 2000

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Thomas Han <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 18 Jul 2000 09:17:14 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (28 lines)
Hi all,

I have been noticing on our last batch of boards that we ran, some of the
tsop flash chips were not reflowing properly.  I am not getting very good
toe fillets on the chips and some appear as though they are just sitting on
top of the reflowed solder.  This board has a good component mix(i.e. BGA,
QFPs, PLCCsocket, SOICs, total(325-350)).  Other components reflow fine,
but for some reason these TSOPS are not.  Is there something that we are
overlooking?

Your input would be greatly appreciated.  Thanks in advance

Tom

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
##############################################################

ATOM RSS1 RSS2