Stephen,
The stress test(s) chosen have nothing to do with package type and
everything to do with the end item operating environment.
Bruce Misner
> ----------
> From: Stephen Ayotte[SMTP:[log in to unmask]]
> Reply To: TechNet E-Mail Forum.;[log in to unmask]
> Sent: Tuesday, July 18, 2000 11:31 AM
> To: [log in to unmask]
> Subject: [TN] Reliability Testing
>
> I am looking for a set of specifications that describe tests that can be
> performed on modules/packages to simulate field conditions and therefore
> in
> a lab environment get an idea of the reliability of the package; PBGA,
> TSOP, whatever.
>
> Jedec today lists a number of stresses; high temperature storage, thermal
> cycling, temperature/humidity + bias. But what I am not able to figure
> out
> is which stress is applicable to which package type. I believe it is safe
> to break package types in to 2 distinct groups; leaded and non leaded.
> Leaded packages would be TSOP, LQFP, TQFP, etc. Non leaded packages would
> be PBGA, FBGA, etc.
>
> Any help would be appreciated.
>
> Thanks.
>
> Stephen Ayotte, IMD Manufacturing Quality Engineer
> Dept. N62V, Bldg. 966-2, Office 2J1309, Mail Drop 967A
>
> Phone (802) 769-4775, t/l 446-4775, Fax (802) 769-4139
> Pager (802) 878-5386 Pin #4685 - external, 74685 - internal
>
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