I am looking for a set of specifications that describe tests that can be
performed on modules/packages to simulate field conditions and therefore in
a lab environment get an idea of the reliability of the package; PBGA,
TSOP, whatever.

Jedec today lists a number of stresses; high temperature storage, thermal
cycling, temperature/humidity + bias.  But what I am not able to figure out
is which stress is applicable to which package type.  I believe it is safe
to break package types in to 2 distinct groups; leaded and non leaded.
Leaded packages would be TSOP, LQFP, TQFP, etc.  Non leaded packages would
be PBGA, FBGA, etc.

Any help would be appreciated.

Thanks.

Stephen Ayotte, IMD Manufacturing Quality Engineer
Dept. N62V, Bldg. 966-2, Office 2J1309,   Mail Drop 967A

Phone (802) 769-4775,    t/l 446-4775,  Fax (802) 769-4139
Pager (802) 878-5386 Pin #4685 - external,    74685 - internal

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