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July 2000

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Subject:
From:
"Noble, Ed" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 18 Jul 2000 07:32:56 -0400
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Hello Fellow TechNets,

        I'm submitting this for feedback.

        For our SMT Assembly lines (stencil; pick-n-place; reflow), I'm
curious as to how companies address ESD issues that can come into play.  We
process .032 and .062 multi-layer, mixed technology, panelized boards.
        We have a fairly sound 'grass-root' ESD program throughout
Manufacturing, and questions have come up lately regarding the SMT Lines (we
have two of them).

                                                        Thanks In Advance,
Ed Noble




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