TECHNET Archives

July 2000

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 17 Jul 2000 16:57:20 EDT
Content-Type:
text/plain
Parts/Attachments:
text/plain (29 lines)
Hi Mirka
Recent experience tells me that you need to do as many of the
inspections as possible - visual and thermal stress microsections.
That is unless and until you have correlation and confidence in
inspections performed by the board house.  After you have that
level of confidence you might be able to lessen the number and
frequency of tests, but not until then.  You will come across the
full spectrum in board houses as to the amount of testing done
prior to shipping the boards as compliant.  It is so much better
to find problems prior to attaching all those components.

Susan Mansilla
Technical Director
Robisan Laboratory

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
##############################################################

ATOM RSS1 RSS2