Hi all,

In the section concerning conformal coating in IPC-A-610,
it is said that no bubbles should bridge lands or pins.  Now
we do conformal coating on some boards with surface mount IC,
some are 751A-02 casing, some others in fine pitch casing etc.

It seems like sometimes, the coating will make some kind of thin
film between two pins of the ICs, causing air to be trapped under
those pins.  I was wondering if this could be a cause of
rejection.  Other than that problem, the coating is smooth and
free of bubbles.

Thank You in advance.

JF

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