Steve,
        Don't be intimidated!!!  They're not at bad as you might think.  You
already know the proper principles of profiling BGA's, the same principles
work on the mini's as well.  The one thing you may want to watch for is high
air flow moving your part around.  If that happens, lower the air pressure
to the machine.  Better yet, twist OK's arm into making an high/low air
pressure switch that will automatically activate based on the profile you
select.

Thanks

Ryan Grant
Advanced Technology Engineer
MCMS
(208) 898-1145
[log in to unmask]


> -----Original Message-----
> From: Stephen R. Gregory [SMTP:[log in to unmask]]
> Sent: Tuesday, July 11, 2000 3:48 PM
> To:   [log in to unmask]
> Subject:      [TN] Micro BGA rework...
>
> Hi all,
>
> Has anybody had good success reworking micro BGA's? Say just from the
> standpoint of removing one part and putting a new one back on the board.
> I've
> never had the pleasure of doing it..(never really looked forward to it
> either).
>
> I'm just wondering how successful it is. We maybe getting a board that has
> two 256-ball devices on it. It's a very small board that is just a wide as
> the Micro BGA, about 4-inches long, and has double-sided SMT. There's
> tantalum capacitors right beneath the Micro BGA's too.
>
> I know there's rework heads (we've got a OK BGA-3000 rework station), and
> micro-stencils and stuff like that out there for this, but that's
> different
> than actually doing it...
> I'm just curious to know if anybody has ever done this and what kind of
> hill
> I'll need to climb if we ever should need to rework any...
>
> Thanks!
>
> -Steve Gregory-
>
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