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July 2000

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Subject:
From:
Pat Kane <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 13 Jul 2000 11:59:50 EDT
Content-Type:
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Bill

From our experiences with helping people change over or setup new lines and
addressing cleaning issues, we would offer the following suggestions of
features to include in the equipment you purchase.

Wave
1.  Solder pot capable of higher temperature range.  Sometimes referred to as
"Lead Free Ready"
2.  Insist on having adequate topside preheaters in addition to the standard
bottomside heaters
3.  Foam fluxing has the best results for most OA fluxes
4.  Look for the ability to adjust/optimize the airknife after fluxer to
control the flux volume on the PCB
5.  Having the system rigged for nitrogen may be something to consider if you
ever think you will need it in the future.  Easier done at factory than a
field retrofit.

Cleaner
1.  Select nozzles types that are low pressure/high flood
2.  System should be configured with wash isolation to allow the addition of
saponifier when needed (cleaning of low profile components)
3.  Wet isolation after wash to protect rinse stages from dragout when using
saponifier
4.  Match the drying stage capability to the complexity of the assemblies to
be dried (sufficient heat, airflow, length)

Hope these ideas help.  Happy hunting.

Pat Kane
Technical Sales Manager
Contamination Studies Laboratories

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