Actually, no! This BGA is standard in that there's no metal-top and it is
configured standard in every way.



> -----Original Message-----
> From: Stephen R. Gregory [SMTP:[log in to unmask]]
> Sent: Wednesday, July 12, 2000 7:06 PM
> To:   [log in to unmask]
> Subject:      Re: [TN] BGA Reflow Problems
>
> In a message dated 07/12/2000 4:35:22 PM Central Daylight Time,
> [log in to unmask] writes:
>
> > Hello technetters,
> >
> >  I'm having a strange problem at my new digs. We have an outer-arrayed
> 256
> >  pin BGA going on a 6 layer FR-4 board. Everything is standard. The
> problem
> >  is the rework. We have a Conceptronic station and the nozzle we are
> using
> >  does not fully encapsulate the component. It always stays about 1/8"
> off
> the
> >  board. Therefore, I am not getting full underside airflow. The techs
> are
> >  using extremely high temperatures to get the component to reflow. I am
> >  wondering this: if I run a standard profile (using previous BGA reflow
> >  experience) and the part won't even begin to reflow, can I chalk it up
> to
> >  the airflow problem. I am guessing that the reason that using
> abnormally
> >  high temps is reflowing the part, then it's only happening by
> conduction
> >  through the part, not proper heat getting under it. Also, in this
> regard,
> if
> >  I'm only reflowing by conduction through the part, then what's
> happening to
> >  the integrity of the part? Please help.
> >
> >  Jason Gregory
> >  ACT Manufacturing-Production Supervisor
> >  Corinth, MS.
> >  (662)287-3771 x470
>
> Hi Jason!
>
> What is this part? Is it one of the newer T.I. parts? The ones with the
> heat-sink in it? That may be a part of the problem. The newer BGA's have
> heat-sinks incorporated in them and present a bunch of new problems during
> manufacturing...
>
> Just curious...
>
> -Steve Gregory-
>
> ##############################################################
> TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
> ##############################################################
> To subscribe/unsubscribe, send a message to [log in to unmask] with
> following text in
> the body:
> To subscribe:   SUBSCRIBE TECHNET <your full name>
> To unsubscribe:   SIGNOFF TECHNET
> ##############################################################
> Please visit IPC web site (http://www.ipc.org/html/forum.htm) for
> additional
> information.
> If you need assistance - contact Keach Sasamori at [log in to unmask] or
> 847-509-9700 ext.5315
> ##############################################################

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
##############################################################