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Subject:	Re: BGA Reflow Problems
From:	"Stephen R. Gregory" <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Wed, 12 Jul 2000 20:05:58 EDT
Content-Type:	text/plain
Parts/Attachments:	text/plain (51 lines)

In a message dated 07/12/2000 4:35:22 PM Central Daylight Time,
[log in to unmask] writes:

> Hello technetters,
>
>  I'm having a strange problem at my new digs. We have an outer-arrayed 256
>  pin BGA going on a 6 layer FR-4 board. Everything is standard. The problem
>  is the rework. We have a Conceptronic station and the nozzle we are using
>  does not fully encapsulate the component. It always stays about 1/8" off
the
>  board. Therefore, I am not getting full underside airflow. The techs are
>  using extremely high temperatures to get the component to reflow. I am
>  wondering this: if I run a standard profile (using previous BGA reflow
>  experience) and the part won't even begin to reflow, can I chalk it up to
>  the airflow problem. I am guessing that the reason that using abnormally
>  high temps is reflowing the part, then it's only happening by conduction
>  through the part, not proper heat getting under it. Also, in this regard,
if
>  I'm only reflowing by conduction through the part, then what's happening to
>  the integrity of the part? Please help.
>
>  Jason Gregory
>  ACT Manufacturing-Production Supervisor
>  Corinth, MS.
>  (662)287-3771 x470

Hi Jason!

What is this part? Is it one of the newer T.I. parts? The ones with the
heat-sink in it? That may be a part of the problem. The newer BGA's have
heat-sinks incorporated in them and present a bunch of new problems during
manufacturing...

Just curious...

-Steve Gregory-

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