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July 2000

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Subject:
From:
Jason Gregory <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 12 Jul 2000 16:18:13 -0500
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Hello technetters,

I'm having a strange problem at my new digs. We have an outer-arrayed 256
pin BGA going on a 6 layer FR-4 board. Everything is standard. The problem
is the rework. We have a Conceptronic station and the nozzle we are using
does not fully encapsulate the component. It always stays about 1/8" off the
board. Therefore, I am not getting full underside airflow. The techs are
using extremely high temperatures to get the component to reflow. I am
wondering this: if I run a standard profile (using previous BGA reflow
experience) and the part won't even begin to reflow, can I chalk it up to
the airflow problem. I am guessing that the reason that using abnormally
high temps is reflowing the part, then it's only happening by conduction
through the part, not proper heat getting under it. Also, in this regard, if
I'm only reflowing by conduction through the part, then what's happening to
the integrity of the part? Please help.

Jason Gregory
ACT Manufacturing-Production Supervisor
Corinth, MS.
(662)287-3771 x470
[log in to unmask]

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