TECHNET Archives

July 2000

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Kelly M. Schriver" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 26 Jul 2000 19:51:01 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (68 lines)
Steve -

Good lookin' mess - my first suspicion is organics on the board surface at
the t ime of LPI application; second suspicion is too hot/fast a cure
process, skinning the mask before it could expel its volatiles.  Regardless,
the problem appears to belong to the fab house at this stage.

Regards - Kelly


-----Original Message-----
From: Stephen R. Gregory <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Wednesday, July 26, 2000 2:17 PM
Subject: [TN] "Bubbly Soldermask..."


>Hi all!
>
>We just got some boards in at receiving inspection that have thousands of
>little "bubbles" in the soldermask all over the boards...they seem to
>concentrate all along the edges of the features of the board. You can see
>pictures of it at:
>
>http://www.driveway.com/share?sid=e25a88c4.8e904&name=Pictures
>
>One picture is bubblemask.jpg, the other is bubblemask2.jpg...what would
>cause that? It's a LPI...don't know the brand name. I'm thinking that
either
>the boards weren't dry or cleaned well prior to soldermasking them. I'm
>rejecting the boards of course...
>
>My freedrive is filling up fast with all the pictures of the "pretty
boards"
>that we get from our vendors!!!
>
>-Steve Gregory-
>
>##############################################################
>TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
>##############################################################
>To subscribe/unsubscribe, send a message to [log in to unmask] with following
text in
>the body:
>To subscribe:   SUBSCRIBE TECHNET <your full name>
>To unsubscribe:   SIGNOFF TECHNET
>##############################################################
>Please visit IPC web site (http://www.ipc.org/html/forum.htm) for
additional
>information.
>If you need assistance - contact Keach Sasamori at [log in to unmask] or
>847-509-9700 ext.5315
>##############################################################

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
##############################################################

ATOM RSS1 RSS2