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July 2000

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From:
"Valladares, Hector A (FL51)" <[log in to unmask]>
Date:
Wed, 19 Jul 2000 13:06:29 -0400
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1.0
X-To:
Thomas Han <[log in to unmask]>
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"TechNet E-Mail Forum." <[log in to unmask]>, "Valladares, Hector A (FL51)" <[log in to unmask]>
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Hi Tom,
I would look at two item to start.
First verify that your parts are not bottoming out on vias underneath the
part.  Second is to see if the leads are made of alloy 42.
Best of luck

Hector Valladares
Honeywell -SASSO
Production Staff Engineer
727.539.3683 voice
[log in to unmask]



-----Original Message-----
From: Thomas Han [mailto:[log in to unmask]]
Sent: Tuesday, July 18, 2000 12:17 PM
To: [log in to unmask]
Subject: [TN] Reflow Issue


Hi all,

I have been noticing on our last batch of boards that we ran, some of the
tsop flash chips were not reflowing properly.  I am not getting very good
toe fillets on the chips and some appear as though they are just sitting on
top of the reflowed solder.  This board has a good component mix(i.e. BGA,
QFPs, PLCCsocket, SOICs, total(325-350)).  Other components reflow fine,
but for some reason these TSOPS are not.  Is there something that we are
overlooking?

Your input would be greatly appreciated.  Thanks in advance

Tom

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