These reports are most intriguing. Lifting of pads and/or traces during
wave soldering or surface mount reflow should not occur when the process
is properly designed and the boards properly fabricated. Can anyone who
has experienced these failures please provide details of the peak
process temperatures? Many thanks.

Jim Smith
Managing Director
Cambridge Management Sciences, Inc.
4285 45th St. S.
St. Petersburg, FL 33711-4431
Tel: (727)866-6502 ext. 21
Fax: (727)867-7890
eMail: [log in to unmask]

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