LEADFREE Archives

July 2000

Leadfree@IPC.ORG

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Subject:
From:
"ARSLANIAN,GREGORY K." <[log in to unmask]>
Reply To:
Leadfree Electronics Assembly E-Mail Forum.
Date:
Wed, 19 Jul 2000 12:29:21 -0400
Content-Type:
text/plain
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text/plain (53 lines)
James:

One process modification is to use an inert atmosphere, such as nitrogen
during the assembly phase.  This will reduce or eliminate oxidation of the
filler material in the ECA materials and also reduce oxidation of the OSP
coated copper metallization of the PCB.

Greg Arslanian
Air Products and Chemicals,Inc.


-----Original Message-----
From: James Canner [mailto:[log in to unmask]]
Sent: Wednesday, July 12, 2000 3:33 PM
To: [log in to unmask]
Subject: Re: [LF] lead free terminations


There have already been a number of excellent responses, so I want to turn
this around and consider the use of conductive polymeric terminations on
passive devices.  How can they be attached to OSP copper board with out
oxidation of the filler metal (usually silver ) and the circuit board metal
usually copper.  It seems to me that each supplier is using what is
necessary to make his product perform in usual application.  Therefore any
new application method or material will possibly affect the total assembly
process.

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with following text in the body:
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###############################################################
Please visit IPC's Center for Lead-Free Electronics Assembly
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For technical support contact Keach Sasamori [log in to unmask] or 847-790-5315.
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