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| Reply To: | DesignerCouncil E-Mail Forum. |
| Date: | Wed, 12 Jul 2000 14:40:44 -0500 |
| Content-Type: | text/plain |
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Hi All,
Does anyone know of any specs for the amount of glue/adhesive needed for
various SMT parts? And/or, is there a spec for the stencil size of these
same parts? Specifically, 0805, 1206, 0603 etc.
IPC-D-330 8.6.6--8.6.6.17 has some references as to bond strength,
flexibility, solvent resistance, outgassing, etc., etc. but not amounts
suggested for certain packages.
TIA for any responses...
Bill Brooks
Design Tech./Librarian
SLM Electronics
1901 Congressional
St. Louis, MO 63146
(314) 569-0141 Ext. 1660
E-mail: [log in to unmask]
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