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| Reply To: | DesignerCouncil E-Mail Forum. |
| Date: | Thu, 13 Jul 2000 09:09:55 -0500 |
| Content-Type: | text/plain |
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Thanks to All who replied,
Our local chapter (STL-GC) has a meeting tonite, and I think I'll be able to get some information/hints etc. from
the other members.
Again, Thanks
Bill Brooks
Design Tech./Librarian
SLM Electronics
1901 Congressional
St. Louis, MO 63146
(314) 569-0141 Ext. 1660
E-mail: [log in to unmask]
> Hi All,
>
> Does anyone know of any specs for the amount of glue/adhesive needed for
> various SMT parts? And/or, is there a spec for the stencil size of these
> same parts? Specifically, 0805, 1206, 0603 etc.
>
> IPC-D-330 8.6.6--8.6.6.17 has some references as to bond strength,
> flexibility, solvent resistance, outgassing, etc., etc. but not amounts
> suggested for certain packages.
>
> TIA for any responses...
>
> Bill Brooks
> Design Tech./Librarian
> SLM Electronics
> 1901 Congressional
> St. Louis, MO 63146
> (314) 569-0141 Ext. 1660
> E-mail: [log in to unmask]
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