Bill - I don't know of any specific specifications because of the wide
variety of adhesives, viscosities, and dispensing or stenciling
applications. Based on my past experience, your Manufacturing Engineers need
to determine which adhesive best suits their applications and processes; how
large a gap they need to fill between the component and the PCB (i.e. will
they have traces underneath the part); whether they want to use one or
multiple dots; bond strength for various thicknesses; reworkability after
soldering; and numerous other factors. Ed/

Ed Valentine
Electronics Manufacturing Solutions
8612 Mourning Dove Road, Raleigh, NC 27615
Phone: (919) 270-5145, Fax: (919) 847-9971
Email: [log in to unmask]
Website: http://www.ems-consulting.com

----- Original Message -----
From: Bill Brooks <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, July 12, 2000 3:40 PM
Subject: [DC] GLUE "DOTS"


> Hi All,
>
> Does anyone know of any specs for the amount of glue/adhesive needed for
> various SMT parts?  And/or, is there a spec for the stencil size of these
> same parts?  Specifically, 0805, 1206, 0603 etc.
>
> IPC-D-330 8.6.6--8.6.6.17 has some references as to bond strength,
> flexibility, solvent resistance, outgassing, etc., etc. but not amounts
> suggested for certain packages.
>
> TIA for any responses...
>
> Bill Brooks
> Design Tech./Librarian
> SLM Electronics
> 1901 Congressional
> St. Louis, MO 63146
> (314) 569-0141 Ext. 1660
> E-mail: [log in to unmask]