Good morning Bill,



we use a stencil with a thickness of 0.2mm. The hole sizes vary between

0.5mm and 1mm in diameter, depending on the package size. For a 0603 we use

a central glue dot with 0.5mm dia and two dots with 0,5mm for 0805.



Volkmar



Bill Brooks wrote:



> Hi All,

>

> Does anyone know of any specs for the amount of glue/adhesive needed for

> various SMT parts?  And/or, is there a spec for the stencil size of these

> same parts?  Specifically, 0805, 1206, 0603 etc.

>

> IPC-D-330 8.6.6--8.6.6.17 has some references as to bond strength,

> flexibility, solvent resistance, outgassing, etc., etc. but not amounts

> suggested for certain packages.

>

> TIA for any responses...

>

> Bill Brooks

> Design Tech./Librarian

> SLM Electronics

> 1901 Congressional

> St. Louis, MO 63146

> (314) 569-0141 Ext. 1660

> E-mail: [log in to unmask]



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  Volkmar Huß                                   Dräger ProTech GmbH

  Engineering Electronic Circuit Boards         Elektronikbaugruppen

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