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Reply To: | TechNet E-Mail Forum. |
Date: | Mon, 31 Jul 2000 14:46:10 -0700 |
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Ron,
Can you share what IWT you are using?? I would also be interested in the
results of your
analysis, if you care to share that data as well.
Tks....DT
At 04:13 PM 7/31/00 -0500, you wrote:
>Hello TechNet:
>We performed some experiments on Immersion White Tin boards and found the
>following . . . . First, we had no problems with solder paste application.
>Second, no problems with vision systems, etc., and part placement. Third,
>solder joints looked pretty good . . i.e. . no problems. Here is the
>kicker. The mounting holes on the top side were white tin. The mounting
>holes need to be very flat for good contact so we do not apply solder paste
>to these holes. The white tin, after exposure to humidity of the
>environmental chambers looked very oxidized and a flaky white powdery like
>substance was observed. Also under some RF type connectors, the white
>powdery like substance was observed. The powdery like flaky substance did
>not show up under any other components only the gold RF connectors.
>
>What experience have any of you had with the immersion white tin process?
>Any ideas, thoughts, etc., on the powdery white substance??? We are going to
>have our "product assurance forensic lab" analyze it and see what they come
>up with, but we also thought it a good idea to tap the intelligence of the
>TechNet World as well.
>
>Ron Hollandsworth
>ITT
>
>
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