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Reply To: | TechNet E-Mail Forum. |
Date: | Mon, 31 Jul 2000 16:13:36 +0300 |
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Luis
WHOA! No irrelevant advertising here, please.
Brian
Luis Gallegos wrote:
> Good morning Stephen
> We have a glue dispenser in line with our process that applies adhesive and
> solder paste dots. When applying solder paste dots we are getting
> consistently getting good solder joints .
> I hope this help
>
> Luis Gallegos
> Sanmina (kenosha)
> [log in to unmask] <mailto:[log in to unmask]>
> 262 947-7700
>
> -----Original Message-----
> From: Stephen Thornton [SMTP:[log in to unmask]]
> Sent: Sunday, July 30, 2000 8:40 PM
> To: [log in to unmask]
> Subject: [TN] Wave Solering SOT23
>
> To All Technetters,
> This question has probably been asked many times but I'll ask the
> experts one more time
> Can anyone tell me how to get good solder perfomance when wave
> soldering SOT23 packages
> We have tried quite a few different things but cannot seem to get
> consistently good joints on a range of different boards and products.
> We have layed out the lans and pads to the IPC recommendations and
> tried going larger, smaller and different orientation etc with no major
> success.
> Has anyone out there got the key to this one?
> Any suggestions would be appreciated.
> Please reply to the forum so that all can share the wisdom
> Thanks in advance
>
> Stephen Thornton
> Engineering Manager Tytronics
> 12 Circuit Drive Hendon SA 5014
> Telephone: +61 (0)8 8268 5400
> Fax: +61 (0)8 8268 2503
>
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