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Date: | Mon, 24 Jul 2000 08:12:09 -0700 |
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Moisture corrosion of a glass diode.
Jason
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Pat Kane
Sent: Friday, July 21, 2000 12:09 PM
To: [log in to unmask]
Subject: Re: [TN] Failure analysis
In a message dated 7/19/00 1:02:02 PM US Eastern Standard Time,
[log in to unmask] writes:
>
> If the time to failure is known (10 months) how can I develop an internal
> stress test to facilitate a failure in less times (like 3 weeks)
> I don't have a HALT chamber, but two thermal chambers
Jason
What is the failure you are investigating? Dendritic growth? Cracked
solder
joints? To develop an accelerated test method depends on the mechanism you
want to accelerate.
>
> The stresses that I want to use are
>
> high temp (85 degrees C)
> low temp (-40 degrees C)
> salt water bath
> powered cycle
All at once, or uniquely different tests?
>
> The module is encapsulated, weight approx. 0.3 Kg,
>
> PS: I don't like calculus!!!
No one does.
>
> Thanks for your help
>
> Jason Larson
Pat Kane
Technical Sales Manager
Contamination Studies Laboratories
>
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