TECHNET Archives

July 2000

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
TechNet <[log in to unmask]>
Subject:
Re: Controlled Impedance Testing
From:
"Smith, Gary" <[log in to unmask]>
Date:
Fri, 7 Jul 2000 11:03:40 -0400
Content-Type:
text/plain; charset="iso-8859-1"
MIME-Version:
1.0
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, "Smith, Gary" <[log in to unmask]>
Parts/Attachments:
text/plain (29 lines) 
Would anyone know how the hydroscopic values/parameters of SMA after
reflow/wave soldering?

I've been able to find references of things being "more" or "less" than
"this" or "that" but nothing in the area of percentages with respect to
moisture absorption after going through an aqueous bath process.

Thanks

Gary Smith
Summer Intern
Rochester Institute of Technology
Computer Integrated Manufacturing Engineering Technology
Class of 2001

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
##############################################################

ATOM RSS1 RSS2