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July 2000

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From:
Luis Gallegos <[log in to unmask]>
Date:
Mon, 31 Jul 2000 07:52:07 -0500
MIME-Version:
1.0
X-To:
Stephen Thornton <[log in to unmask]>
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, Luis Gallegos <[log in to unmask]>
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Good morning Stephen
We have a glue dispenser in line with our process that applies adhesive and
solder paste dots. When  applying solder paste dots we are getting
consistently getting good solder joints .
I hope this help

Luis Gallegos
Sanmina (kenosha)
[log in to unmask] <mailto:[log in to unmask]>
262 947-7700

        -----Original Message-----
        From:   Stephen Thornton [SMTP:[log in to unmask]]
        Sent:   Sunday, July 30, 2000 8:40 PM
        To:     [log in to unmask]
        Subject:        [TN] Wave Solering SOT23

        To All Technetters,
        This question has probably been asked many times but I'll ask the
experts one more time
        Can anyone tell me how to get good solder perfomance when wave
soldering SOT23 packages
        We have tried quite a few different things but cannot seem to get
consistently good joints on a range of different boards and products.
        We have layed out the lans and pads to the IPC recommendations and
tried going larger, smaller and different orientation etc with no major
success.
        Has anyone out there got the key to this one?
        Any suggestions would be appreciated.
        Please reply to the forum so that all can share the wisdom
        Thanks in advance

        Stephen Thornton
        Engineering Manager Tytronics
        12 Circuit Drive Hendon SA 5014
        Telephone: +61 (0)8 8268 5400
        Fax: +61 (0)8 8268 2503

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