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July 2000

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Sender:
TechNet <[log in to unmask]>
Subject:
Adhesive contamintation
From:
Becerra Alejandro <[log in to unmask]>
Date:
Fri, 14 Jul 2000 16:50:57 -0500
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"TechNet E-Mail Forum." <[log in to unmask]>, Becerra Alejandro <[log in to unmask]>
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text/plain (695 bytes) , 0603soldera1.jpg (26 kB) 
Good afternoon Technetters,

I am sending a photo of one cross section of an 0603 component soldered in
the bottom side.
The photo shows how in the left terminal of the component there are not
solder between the metallization and the pad. The right terminal shows
solder between the metallization and the pad.
This effect is caused by adhesive contamination over the pad.
Unfortunately this condition is not clearly observed in the photo, but it is
observed in the microscope.
The fillet that is formed in the end side of the component is not affected.
Is this condition acceptable?

Thanks in advance for your help,

 <<0603soldera1.jpg>>



Alejandro Becerra
Phone (915) 841-8518, Fax (915) 841-8518
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