For small boards, like mobphone boards, we use ESEM and tilting. Of course not suitable for inline inspection, but tells a lot more than light. A large chamber SEM with low kV will also make it. Comments?
Ingemar


-----Original Message-----
From: Lee Whiteman [mailto:[log in to unmask]]
Sent: den 2 juni 2000 21:22
To: [log in to unmask]
Subject: Re: [TN] Other visual tests under a BGA possible?


Jurgen,

The one that I am familiar with is an ERSASCOPE. It operates in a similar
fashion as what you described. However, a fiber optic cable does not go
underneath the component as you suggested. You look under a component via a
series of prisms. Looking at the internal solder balls (behind the outside
perimeter solder balls) is feasible but may be difficult.

2 websites that have some information on it are: http://csitechnet.com/ and
http://www.ersa.com/.

Another system is the Caltex 3-D Hi-scope and BGA scope. Their website is:
http://www.hi-scope.com/.

Manncorp does offer visual inspection systems. Their website is:
http://www.manncorp-smt.com/.


Lee Whiteman
Senior Manufacturing Engineer
ACI / EMPF
Telephone: (610) 362-1200; Ext. 208
FAX: (610) 362-1290
E-Mail: [log in to unmask]


-----Original Message-----
From:   TechNet [mailto:[log in to unmask]] On Behalf Of Jurgen Kruger
Sent:   Friday, June 02, 2000 11:22 AM
To:     [log in to unmask]
Subject:        [TN] Other visual tests under a BGA possible?

Dear Members!

With interest I follow your discussion about X-ray testing of BGAs. I would
like to know, are there any other visual tests possible, to look under a
soldered BGA? For example, with a very tiny camera using a
glass-fibre-cable, say 0,5mm diameter? Is something like this in use? Or
makeable? Would need a very tiny optical system? I got the impression, to
solder BGAs reliable is a very delicate thing, isn't it?

Sorry for my stupid statements, but I haven't any experience in BGAs nor
testing of PCBs.
Jurgen.

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