Rick ,

  MAKE sure that all the components are temp rated to survive reflow.

   After that the only "big" problem is stencil opening design to get a sufficient
amount of solder on the pad. Our stencil house was VERY helpful.

  We have been doing PIH for over 2 years.
      DB9, DB15 , and DB25.
      Saves a lot of labor costs.

       Good luck.

     Ralph Garvin
         Westport Research, Inc.
              Raytown, Mo. 64133



> I know there was some discussion here awhile back on intrusive reflow
> (paste-in-hole) but I haven't been able to get into the archives to check.
> Basically, we have a customer who wants to place a DB-25 connector and some
> .100" pitch headers on a surface mount assembly. Does anyone have any
> experiences, recommendations, etc. they'd care to share on this process,
> especially if it's with the type of parts mentioned?  Any good references or
> other places I can look for this type of information?
>
> Thanks,
>
> Rick Thompson
> Ventura Electronics Assembly
> 2665A Park Center Dr.
> Simi Valley, CA 93065
>
> +1 (805) 584-9858 voice
> +1 (805) 584-1529 fax
> [log in to unmask]
>
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