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June 2000

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Subject:
From:
David Whalley <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 1 Jun 2000 15:30:14 +0100
Content-Type:
text/plain
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text/plain (41 lines)
Jonathan,

At 09:42 AM 6/1/00 +0800, you wrote:
>Does anyone had experience to use 3D modeling software that analyzes thermal,
>structural, etc (multi physics)
>Any recommendation is highly appreciated
>
>thanks
>
>
>Jonathan A. Noquil
>Package Design/Development Eng'r
>Fairchild Semiconductor, PEZA
>Lapu-Lapu City, CEBU
>The Philippines

Many FE type packages can seperately cope with more than one type of physics
e.g. thermal and stress, and can also often take results from e.g. a thermal
model to use as loads for a stress model - are you looking for this type of
analysis, or are you dealing with situations where the different physics are
coupled?

Also are you looking for something targeted at electronics products (builds
a model from your PCB CAD file) or a more general purpose modelling tool?

David Whalley

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