circuitgirl,
        As you can see from the lack of postings, there aren't many users of
immersion tin.  As a matter of fact, there aren't many suppliers of
immersion tin.  However, the scare with "black pad" associated with ENIG is
causing the immersion white tin to receive attention as an alternate to
gold.  Unfortunately, the lack of wide spread use has discouraged its
implementation.
        There is certainly a risk involved with using a technology or
process that no-one else is using.  This risk has discouraged the "big boys"
from putting their reputation on the line and going to immersion white tin.
Especially since its benefits are questionably better than OSP.  However, if
the black pad issue isn't solved soon, I think more people will start using
immersion white tin or even immersion silver.  If either of these finishes
hold up to their claims, they may topple ENIG as the preferred finish for
high density boards.
        Thanks

Ryan Grant
Advanced Technology Engineer
MCMS
(208) 898-1145
[log in to unmask]


> -----Original Message-----
> From: [log in to unmask] [SMTP:[log in to unmask]]
> Sent: Thursday, June 01, 2000 1:18 PM
> To:   [log in to unmask]
> Subject:      [TN] Immersion White Tin
>
> I hope to generate some discussion on this subject, since there wasn't
> much
> from last weeks questions on immersion white tin...
>
> We (as a PCB fabricator) have had several inquiries about immersion white
> tin from our customers, but we don't see any of the large OEM's making a
> move towards it.
> Any opinions out there?
>
>
>
>
>
>
>
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