Good Morning,

I have an application that requires using a 474 ball and a 250 ball
CBGA in a military environment.  These will be mounted on a random
kevlar Polyimide board, soft bonded to an aluminum thermal core.  Has
anyone had similar experience, and what have you learned?  Also will I
need to underfill the parts?  If so, what would you recommend for an
underfill material?  Thanks in advance for any help.

Bill

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