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June 2000

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Subject:
From:
Ruby Hazen <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 28 Jun 2000 11:15:22 PDT
Content-Type:
text/plain
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text/plain (26 lines)
Hello all:

We try to fully or partially fill the via holes (<0.025" diameter) with
solder due to the process. I'm wondering that if there are some concerns
(such as fatigue).

Any information are very welcome. Thanks a lot!

R.H.
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