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June 2000

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Subject:
From:
Bev Christian <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 28 Jun 2000 07:50:25 -0400
Content-Type:
text/plain
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text/plain (67 lines)
Yuan,
The SUNY (Binghamton) members of the Universal Instruments led research
consortium have done a lot of work on this.  However, the current data is
only for consortium members.  Older data is sometimes published as papers in
the open literature.  Seeing as you are from a university they may offer a
certain amount of help to you, a non-member.  But you have to talk to the
consortium, I can't speak for them.  I can't find the business cards for the
overall consortium leader or the prime SUNY researcher for this aspect of
the consortium's work, so here are the particulars for the Manager of the
CSP portion of the consortium:

Anthony Primavera
Universal Instruments Corporation
607-779-5203
[log in to unmask]

regards,
Bev Christian
XLTEK



-----Original Message-----
From: LI YUAN [mailto:[log in to unmask]]
Sent: Tuesday, June 27, 2000 5:33 PM
To: [log in to unmask]
Subject: [TN] Flip chip underfill delamination


Have anyone successfully modeled underfill delamination using Finite
Element modeling? We are looking for building our own internal flip chip
component level modeling capability and need help. Please contact me via
email or @ (408)544-7508.

Regards,

Yuan Li

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