TECHNET Archives

June 2000

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Jonathan A Noquil <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 27 Jun 2000 17:43:07 +0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (78 lines)
Hi Terry,

In PCBs, palladium is not barrier but instead nickel (Check Electroless
Ni-Immersion Au).
Palladium is used to activate the copper inorder for Nickel (used as barrier) to
plate, you can notice
that every Process in Electroless Ni-Au have an Activator (which is usually
palladium).
You can't plate copper traces with out palladium activation.

In components such leads, they use Palladium (Ni-Pd) to preserve solderability
of the Nickel surface,
they also used palladium (small amount) not as barrier but to prevent cracking
on leads after bending.
If you use palladium as barrier it is too expensive.

Hope this helps

thanks

Jonathan A. Noquil
R&D
FSCB, CEBU, Phils.





Terry Exell <[log in to unmask]> on 06/27/2000 03:50:33 PM

Please respond to "\"TechNet E-Mail Forum.\" <[log in to unmask]>,        Terry
      Exell" <[log in to unmask]>

To:   [log in to unmask]
cc:    (bcc: Jonathan A Noquil/Cebu/Fairchild)
Subject:  [TN] Palladium query



Fellow TechNetters,

Can someone please enlighten me as to the purpose of a Palladium Barrier on
components / PCBs.

Best regards

Terry Exell
BAE SYSTEMS, Plymouth, UK

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text
in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
##############################################################

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
##############################################################

ATOM RSS1 RSS2