Alain,
GOOD   Question!!  When I answered I assumed that it had seen a thermal excursion.

Chuck Brummer
Acuson


Alain Savard wrote:

> Looking in IPC A-600F, section 3.3.2, lifted land is NOT allowed in
> cross-sections in the as received condition.
> However if you board has been to any heat cycle (including soldering and
> unsoldering)... It cannot be rejected.
>
> See also IPC-6012, sections 3.3.4 and 3.6.2.9.
>
> So the question is... Did you do anything to your section first?
>
> Alain Savard, B.Sc.
> Chemical Process Analyst
> CAE Electronics Ltd.
> e-mail: [log in to unmask]
>
> -----Original Message-----
> From: Rajesh Goutham [mailto:[log in to unmask]]
> Sent: June 23, 2000 12:17 AM
> Subject: [TN]
>
> This is my first message on the list.
> My name is Rajesh and I am a Production engineer in a PCB manufacturing
> company in India.
>
> Of late we have been bugged by a problem called Pad lift / Land lift.
>
> I am sending an image with the message so that you guys can visualize it.
>
> I would be grateful if any body can share his/her experience with this
> problem.
>
> Rajesh Goutham.
>
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