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June 2000

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Subject:
From:
Paul Klasek <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 26 Jun 2000 08:27:59 +1000
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Good eyes Eric,
I blame my friend Daan for taking my focus off the line of sight.
Just shows Alpha knows the metals perhaps as well as Indians .
Must be me in the sun after all.

Well Eric, lets cry about Argentum, last time i've been validating ALevel,
it did have great solderability, but took fingerprints easy ;
didn't last that long in store, did the coat improve ?

What's your first hand opinion of optimal AL use,
as comparing with NiAu ?
Is Ag in Enthone's repertoire ?
What's you opinion on the baked coat on Ag ?,

http://www.enthone-omi.com,

hmmm, 503$M, a lot of changes, wonder when this cooking stops .

What does omi stands for Erik ?

thanks          paul

PS
Don't tell me everything, some big chefs lurk around too .



-----Original Message-----
From: Eric Yakobson [mailto:[log in to unmask]]
Sent: Saturday, 24 June 2000 3:14
To: [log in to unmask]
Subject: Re: [TN] Au on Ni


Just a minor correction.  Ag stands for argentum, i.e. silver.  The chemical
symbol for gold is Au -- aurum.

Eric Yakobson
Enthone




Paul Klasek <[log in to unmask]> on 06/21/2000 05:40:32 PM

To:   [log in to unmask]
cc:
Subject:  Re: [TN] Ag on Ni - effect of baking in sun ,              related
      tech conten t



I like this one Daan ;
"if the board solders badly ......there is a problem with board"

                             - Daan (with great web site)

Reminds me of

"if we do not succeed, than we run the risk of failure"

"we are ready for any unforeseen event that may or may not occur"

"Verbosity leads to unclear, inarticulate things"

"I am not a part of the problem ; I am a Republican"

                              - Vice President Dan Quayle



And i thought i've been the only one interested in philosophical context of
high tech.
Now i don't feel so lonely .
Werner, leave that No 5 iron in bag ,
this are just classics drifted down under, all same to me.

paul klasek



-----Original Message-----
From: d. terstegge [mailto:[log in to unmask]]
Sent: Wednesday, 21 June 2000 18:41
To: [log in to unmask]
Subject: Re: [TN] Ag on Ni - effect of baking


Hi Richard,

I recently had some solderability problems with Ni/Au boards, where the
boardsuppliers told us we had the problems because of baking or because of a
few days storage time between subsequent soldering steps.
But never could they show me any supporting evidence for baking being such a
bad thing for this type of board. From some helpfull Technetters (people who
I consider much more knowledgable than the average fabs-salesman dealing
with a complaint) I learned that if a Ni/Au board solders badly because of
baking, there is definitely a problem with the board.

Kind Regards,

Daan Terstegge
SMT Centre
Signaal Communications
Unclassified mail
Personal Website: http://surf.to/smtinfo

>>> Richard Tilbrook <[log in to unmask]> 06/21 9:29 am >>>
NEW MESSAGE:

Hi folks,
Sorry, I wasn't feeling well yesterday and did not explan myself at all -
the
reason I asked about baking is that we reflowed one side of a surface mount
board
(gold on nickel); we then stored it in a 45'C oven as we were expecting the
remaining parts to arrive for this very urgent job. They unexpectedly took a
week.
They even more unexpectedly didn't want to reflow properly when we tried
reflowing.
I suggested "passivation" as something for the person who brought me the
problem to
think about, though I must confess that being an industrial placement
student, I am
not best equiped to make that kind of judgement. As I try to follow many of
your TN
discussions, and occasionally add when I feel able, I was sure you'd be able
to
give better reasons as to the cause and suggestions for either prevention or
cure.

Thanks and Regards,

Richard Tilbrook



PREVIOUS MESSAGE:

Hi technetters,
I'm hoping to find out a bit more about the effect of baking (at 45 deg. C)
on
boards with gold on nickel.
I would be grateful for any info on the sibject, including times,
temperatures and
effects, such as passivation.

Thanks,

Richard TIlbrook

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