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June 2000

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Subject:
From:
"Kelly M. Schriver" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Sat, 24 Jun 2000 06:57:47 -0500
Content-Type:
text/plain
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text/plain (78 lines)
Mike -

Contact Richard Snogren at SAS Circuits in Littleton CO - email
[log in to unmask] .  I believe one of their production affiliates has
the white tin process in production.

Regards - Kelly


-----Original Message-----
From: McMonagle, Mike <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Friday, June 23, 2000 9:46 AM
Subject: [TN] Immersion Tin Suppliers


>        I am in the process of evaluating white tin as an alternate surface
>finish for our assemblies that contain fine pitch (<20mil) and uBGA
devices,
>as HASL provides too many 'challenges' for high yields with such
components.
>
>        I have found that our current stateside suppliers, whom we use for
>proto and low volume turns, all farm out the immersion tin processing
>portion to secondary vendors. And our current offshore (volume) vendor is
>just starting to 'test the waters' with white tin, using the Stannatech
>process, also through a secondary vendor.
>
>        As I would like to qualify any evaluation fabs (and future
>purchases) from a source that performs their own white tin process
in-house,
>I am looking for leads on both local and offshore suppliers who have
>internal capability for white tin. Also, any feedback on experiences with
>Atotech's Stannatech vs Omikron vs Dexcoat would be appreciated.
>
>        Onward into the fog....
>
>Mike McMonagle
>PCBA Process Engineering
>Telxon Corporation
>(713) 307-2443 Phone
>(713) 307-2581 Fax
>http://www.telxon.com
>
>' Innovative Solutions for
>Mobile Information and
>Wireless Communications'
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