In a message dated 06/22/2000 6:16:34 PM Central Daylight Time,
[log in to unmask] writes:

> Ken - I suggest you consider using Sn62 solder to slow down the leaching of
>  the Palladium-Silver termination. Do you have a barrier layer or is this
>  just a single layer termination? If a single layer, you may only get one
>  reflow cycle out of the termination before it dissolves into
>  non-wettablility. Why don't you use a standard 3-layer termination?
>
>  Ed Valentine
>  Electronics Manufacturing Solutions
>  8612 Mourning Dove Road, Raleigh, NC 27615
>  Phone: (919) 270-5145, Fax: (919) 847-9971
>  Email: [log in to unmask]
>  Website: http://www.ems-consulting.com

Hi Ken!

I agree with Ed. I ran across some thermistors that had palladium silver
terminations and used a 2% silver paste and the joints looked much better.
These components can't take touch-up though...you put a soldering iron to
them and "POOF" the terminations disappear! (least they did on the
thermistors I dealt with) Your QA will need to back off on how high the
fillets go up the terminations, they won't flow up as high like a tin/lead
termination does. It'll just look a little different like T.I. parts do with
the palladium plating. DON'T TOUCH THEM UP!

-Steve Gregory-

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