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June 2000

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Subject:
From:
"Edward J. Valentine" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 22 Jun 2000 19:17:14 -0400
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Ken - I suggest you consider using Sn62 solder to slow down the leaching of
the Palladium-Silver termination. Do you have a barrier layer or is this
just a single layer termination? If a single layer, you may only get one
reflow cycle out of the termination before it dissolves into
non-wettablility. Why don't you use a standard 3-layer termination?

Ed Valentine
Electronics Manufacturing Solutions
8612 Mourning Dove Road, Raleigh, NC 27615
Phone: (919) 270-5145, Fax: (919) 847-9971
Email: [log in to unmask]
Website: http://www.ems-consulting.com

----- Original Message -----
From: Chafin, Ken G. <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, June 22, 2000 5:45 PM
Subject: [TN] Termination/Soldering Combination


> We are planning to solder some surface mount capacitors with
> palladium-silver terminations on our printed circuit assemblies using
> tin-lead (SN63/37) solder.
>
> Does anyone know of any long term reliability problems with this
termination
> alloy/soldering combination?
>
> We can get these capacitors with nickel-tin terminations.
>
> Given that our solder is tin-lead, does anyone know whether one of these
> termination alloys would be preferable to the other?
>
> Thanks for any insight you may be able to provide.
>
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