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June 2000

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Subject:
From:
Brian Ellis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 1 Jun 2000 12:07:41 +0300
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Martin

The best recommended bake is none, if you do not need to. Baking is detrimental to the
polymer and it enhances oxidation, potentially reducing solderability. If it is
necessary, do it at the lowest temperature (primary) and shortest time (secondary) you
can get away with to achieve the desired results, for whatever reason.

Brian

Martin Christie wrote:

> Hi Technetters,
>
> What is (or where can I find) the recommended bake parameters for baking
> boards before reflow?
>
> Martin Christie
> ACW Technology Ltd.,
> Hylton Road,
> Petersfield,
> Hants.
> GU32 3XX
> Tel: 01730 300000 ext 146
> Fax: 01730 266045
> e-mail: [log in to unmask]
>
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