We have found some internal fab defect (cracking at one of the inner layer)
which we don't know is due to assembly process or fab process induced.

If I were to create a Thermal shock profile to precipitate defect on a
loaded board How can I come out with? I have decided to use -10C to +70C, 10
minutes soaks, +/-20C/minute ramps, 12 cycles which will give a test
duration approx. 3.6 hours.

Any comments will be highly appreciated. All the failed one were found
during ICT testing hence decided to send all lot.

re,
Ken Patel

______________________________________________________
Ken Patel                       Phone:  (408) 490-6804
1708 McCarthy Blvd.             Fax:    (408) 490-6859
Milpitas, CA 95035

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