TECHNET Archives

June 2000

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Brian Ellis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 2 Jun 2000 09:15:53 +0300
Content-Type:
text/plain
Parts/Attachments:
text/plain (80 lines)
Tim

The thermal energy required to remove ab/adsorbed water molecules from a
heterogeneous material is about the same, irrespective of the temperature
(within reasonable limits and provided you do not have a phase change, such as
exceeding the Tg, which, incidentally, drops by about 20 °C when the board is
humid). If you use a vacuum oven, you have extra energy required to turn the
pump and operate the traps. The pump runs hot, after a time, and this heat is
dissipated into the atmosphere and not into the oven. If you use a cryogenic
trap to prevent oil vapour from entering the oven or moisture from emulsifying
the lubricating oil, this also requires energy to produce the removal of heat.
If you use absorber/adsorber traps, they require energy to regenerate. Overall,
vacuum drying requires 50-100% more energy than atmospheric pressure drying,
albeit the temperature may be considerably lower.

Brian

Timothy Reeves wrote:

> When you say that the energy is actually greater, you mean the energy
> imparted to the escaping water molecules, right? But what does that matter?
> What really matters is energy imparted to the board. The board itself may
> actually decrease in temperature if a low enough pressure is obtained. In
> that sense, Doug was right (but he should have said "less heat [transferred
> to the polymer, glass, and copper]")
> I know... you were just trying to point out the misconception most people
> have regarding temperature vs. heat.
> I love these technical arguments... :-)
> Tim Reeves
>
> > ----------
> > From:         Brian Ellis
> > Sent:         Thursday, June 1, 2000 7:54
> > Subject:      Re: Baking of boards
> >
> > Sorry, Doug, the heat is more or less the same. The energy required is
> > actually
> > greater. It is the temperature that is lower.
> >
> > Brian
> >
> > Douglas Pauls wrote:
> >
> > > If you are really concerned about the effects of heat on the polymer
> > > qualities or the oxidation of the surfaces, consider using a vacuum or
> > > vacuum-make operation.  Gets the water out with less heat.
> > >
> > > Doug Pauls
> > >
> > > ##############################################################
> > > TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
> > > ##############################################################
> > > To subscribe/unsubscribe, send a message to [log in to unmask] with
> > following text in
> > > the body:
> > > To subscribe:   SUBSCRIBE TECHNET <your full name>
> > > To unsubscribe:   SIGNOFF TECHNET
> > > ##############################################################
> > > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for
> > additional
> > > information.
> > > If you need assistance - contact Keach Sasamori at [log in to unmask] or
> > > 847-509-9700 ext.5315
> > > ##############################################################
> >

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
##############################################################

ATOM RSS1 RSS2