Hi Richard,

I recently had some solderability problems with Ni/Au boards, where the boardsuppliers told us we had the problems because of baking or because of a few days storage time between subsequent soldering steps. 
But never could they show me any supporting evidence for baking being such a bad thing for this type of board. From some helpfull Technetters (people who I consider much more knowledgable than the average fabs-salesman dealing with a complaint) I learned that if a Ni/Au board solders badly because of baking, there is definitely a problem with the board. 

Kind Regards,

Daan Terstegge
SMT Centre
Signaal Communications
Unclassified mail
Personal Website: http://surf.to/smtinfo

>>> Richard Tilbrook <[log in to unmask]> 06/21 9:29 am >>>
NEW MESSAGE:

Hi folks,
Sorry, I wasn't feeling well yesterday and did not explan myself at all - the
reason I asked about baking is that we reflowed one side of a surface mount board
(gold on nickel); we then stored it in a 45'C oven as we were expecting the
remaining parts to arrive for this very urgent job. They unexpectedly took a week.
They even more unexpectedly didn't want to reflow properly when we tried reflowing.
I suggested "passivation" as something for the person who brought me the problem to
think about, though I must confess that being an industrial placement student, I am
not best equiped to make that kind of judgement. As I try to follow many of your TN
discussions, and occasionally add when I feel able, I was sure you'd be able to
give better reasons as to the cause and suggestions for either prevention or cure.

Thanks and Regards,

Richard Tilbrook



PREVIOUS MESSAGE:

Hi technetters,
I'm hoping to find out a bit more about the effect of baking (at 45 deg. C) on
boards with gold on nickel.
I would be grateful for any info on the sibject, including times, temperatures and
effects, such as passivation.

Thanks,

Richard TIlbrook

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