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June 2000

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Subject:
Solder ball test
From:
"Joseph H. Smith" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 21 Jun 2000 12:26:51 +0800
Content-Type:
text/plain
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text/plain (35 lines) 
     Dear all,

     I meet some questions in solder ball test mentioned in IPC-tm-650.
     Number 2.4.43
     The questions as follow:

     1. What is the hot plate temperature in section 5.2.3.2? Does the
     temperature increase gradually or preset temperature for melting the
     solder paste?

     2. Is there any wrong in section 5.3.3? How come with the 6.5 cm and
     1.5 cm?

     3. What is the acceptance criteria? Are there any quantitative figures
     or size to judge the solder ball?

     Looking forward to your kind reply.

     Best Regards,
     Poon Man

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